Tape Polishing Machine Product List and Ranking from 4 Manufacturers, Suppliers and Companies

Camwrap device

A composite device for tape polishing and brushing that maintains shape without distortion due to the tracking mechanism!

The "Cam Wrap Device" can perform deburring of the cam outer peripheral edge of the camshaft and finish the cam section with tape wrapping. The supply to the in-machine jig is done by the operator, and processing is automatically carried out by the activation switch, with discharge through a chute, making it a semi-automatic machine from which the operator retrieves the finished product. The backup roller of the tape unit follows the shape of the cam through a mechanism driven by a servo motor, ensuring that the shape is not distorted. 【Features】 ■ Equipped with a mechanism that follows the shape using a servo motor, preventing distortion ■ Capable of adjusting parameters such as tape, processing time, and pressure ■ A combined device for tape polishing and brushing, offered at a reasonable price *For more details, please refer to the PDF document or feel free to contact us.

Company：サンシン
Price：Other

Other processing machines
Wafer processing/polishing equipment

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Full Surface Grinding (Z-axis Control)

A Z-axis is provided, employing a mechanism that does not damage the workpiece! Polishing can be done with a soft touch.

This product is a device for polishing the upper surface of ribbed substrates. Until now, tape backup was performed using the pressing force of rollers, but we have introduced a Z-axis and adopted a mechanism that does not damage the workpiece. Polishing is done using a dry method. The workpiece is attached and detached by the operator, and the predetermined cycle is performed automatically in a semi-automatic machine. 【Features】 ■ Capable of Z-axis control, preventing damage to the initial polishing area ■ Adoption of a flat pad avoids concentrated loads, allowing for soft-touch polishing ■ Once set up, anyone can easily use it *For more details, please refer to the PDF document or feel free to contact us.

Company：サンシン
Price：Other

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[Grinding Device] Tape Grinding Unit "BM Series"

Polishing equipment that maximizes the characteristics of polishing film.

The "BM Series" tape polishing unit is a polishing device that maximizes the characteristics of polishing films. Depending on the material of the workpiece, surface roughness management can be easily achieved by selecting the controller and polishing tape. 【Features】 ○ Lightweight and compact design ○ PLC control adopted ○ Capable of dry and wet polishing ○ Soft pressure and fixed-position polishing possible ○ Simplified tape replacement work For more details, please contact us or download the catalog.

Company：Kovax Corporation
Price：Other

Wafer processing/polishing equipment

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Anyone can perform automatic polishing with the tape grinding method!

Achieve all materials from rough polishing to finishing polishing! Automatic polishing machines can also be customized to suit your needs!

We propose a "tape polishing device" that is easier to manage compared to whetstone grinding, allowing anyone to achieve the same finish. You can select the width of the polishing film according to the product, which increases production efficiency and achieves low costs. The polishing film can be easily replaced, allowing for the desired surface roughness according to the purpose. 【Features】 ◆ Precise finishing is possible even for those without experience. ◆ Polishing while feeding the tape ensures a uniform finish with a constantly new abrasive surface. ◆ Precision finishing is possible for inner diameters, outer diameters, and elliptical shapes. ◆ Usable for both dry and wet processes, with a clean and compact processing environment. ◆ Customization of the polishing device is possible according to the purpose and product. *For more details, please refer to the PDF document or feel free to contact us.

Company：三共理化学
Price：Other

Wafer processing/polishing equipment

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Newly developed outer diameter grinding equipment and new technology for clogging prevention unveiled! Tape grinding demonstration as well.

Exhibiting at JIMTOF! Demonstrating tape grinding of ball screws and worms for electric vehicles! Also unveiling a newly developed outer diameter grinding machine and new technology for clogging prevention!

A tape grinding device utilized in high-tech industries such as automotive and electronics. Sanshin, a professional in tape grinding devices, will exhibit at "JIMTOF2018," starting on November 1. On the day of the event, we will demonstrate tape grinding for ball screws and worms used in electric power steering for automobiles. Additionally, we plan to unveil a newly developed outer diameter grinding device and a new technology for clogging suppression using ultrasonic vibrations. 【Event Overview】 JIMTOF2018 Date: November 1 (Thursday) to November 6 (Tuesday), 2018 Venue: Tokyo Big Sight, East Hall 1 (Booth Number: E1073) 【Exhibited Products】 ■ Newly developed! Outer diameter grinding device FPM-D ■ New technology! Grinding tape clogging suppression technology ■ Tabletop outer diameter grinding machine SFT-D1 ■ Outer diameter grinding unit SFM-25R (50R) / R・L ■ Inner diameter grinding unit MFIL-12 ■ Ball screw and worm gear grinding device BSN500-LM *For more details, please request materials or view the PDF data from the download section.

Company：サンシン
Price：Other

Wafer processing/polishing equipment

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Video now available! Outer diameter precision surface finishing machine 'SFM'

Achieves approximately 30% space-saving compared to conventional machines! Precise finishing is possible regardless of experience level! [Patent obtained]

The "SFM" is a unit for precision grinding of shafts and similar components. It can be attached to lathes and allows for precision machining. Additionally, depending on the workpiece, the film width can be selected, enabling high-efficiency and low-cost processing. It is primarily introduced in the final finishing process of various automotive parts shafts and is suitable for improving the roughness of sliding and sealing areas. The outer diameter grinding unit can also be applied to grinding end faces and inclined surfaces. We offer a lineup of grinding units that can be attached to customer lathes and table-top grinding machines equipped with work rotation mechanisms. Furthermore, it can be used for both dry and wet processing, and the processing environment is clean and compact. 【Features】 - Achieves approximately 30% space-saving compared to conventional machines - Can obtain surface roughness according to purpose - Allows for precision finishing regardless of experience level - Capable of uniform finishing with a constantly new abrasive surface - Processing environment is clean and compact *For more details, please refer to the PDF document or feel free to contact us.

Company：サンシン
Price：Other

Wafer processing/polishing equipment
Engine parts
lathe

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Tape polishing device

Overwhelming ease of management compared to whetstone grinding! With condition settings, anyone can achieve the same finish.

We handle the "Tape Grinding Machine" manufactured by Sankyo Rika Co., Ltd. Compared to grinding with grinding wheels, it is overwhelmingly easier to manage, and once the conditions are set, anyone can achieve the same finish. You can choose the width of the polishing film according to the workpiece, enabling high efficiency and low cost. 【Features】 ■ High efficiency and low cost ■ Easy operation ■ Always a new abrasive surface ■ Easy film replacement ■ Variety of abrasives *For more details, please refer to the PDF document or feel free to contact us.